1/4 rev. a structure silicon monolithic integrated circuit product series 1ch motor driver type bd6886gul features ? built in 1 constant-voltage driver ? absolute maximum ratings (ta=25c) parameter symbol limit unit power supply voltage vc c -0.5 to +6.5 v motor power supply voltage vm -0.5 to +6.5 v control input voltage vin -0.5 to vcc+0.5 v input voltage for constant-voltage setting vlim -0.5 to vm+0.5 v power dissipation pd 730 1 mw operating temperature range topr -25 to +85 c junction temperature tjmax 150 c storage temperature range tstg -55 to +150 c h-bridge output current iout -200 to +200 2 ma/ch 1 reduced by 5.84mw/c over 25c, when mounted on a glass epoxy board (50mm ? 58mm ? 1.75mm; 8 layers) 2 must not exceed pd, aso, or tjmax of 150c. ? operating conditions (ta= -25c to +85c) parameter symbol min. typ. max. unit power supply voltage vcc 2.5 3.0 5.5 v motor power supply voltage vm 2.5 5.0 5.5 v control input voltage vin 0 - vcc v input voltage for constant-voltage setting vlim 0 - vm v h-bridge output current iout - - ? 150 3 ma/ch 3 must not exceed pd or aso. the product described in this specificat ion is a strategic product (and/or se rvice) subject to cocom regulations. it should not be exported without authorization from the appropriate government authorities. this product isn?t designed for protection against radioactive rays.
2/4 rev. a ? package outline ? pin arrangement (top view) ? block diagram ? pin no. and pin name no. pin name 1a n.c. 2a outa 3a ps 4a n.c. 1b vm 2b 3b inb 4b ina 1c pgnd 2c vlim 3c sel 4c vcc 1d n.c. 2d outb 3d gnd 4d n.c. 1 2 3 4 a n.c. outa ps n.c. bvm inb ina c pgnd vlim sel vcc d n.c. outb gnd n.c. fig.1 vcsp50l2 package (unit: mm) fi g .3 bd6886gul block dia g ram fig.2 bd6886gul pin arrangement (top view) 6886 lot no. 1pin mark 2.1 0.1 s 0.08 s 0.1 0.05 b 1 5 0 .2 5 0 . 05 0.05 a b d c b a 0.5 2.1 0 .1 0.55 max 0.3 0.1 p=0.5 3 ( 0 .1 p= 0 . 5 3 side view top view bottom view ina ps vm thermal shutdown & uvlo vcc gnd inb sel vlim pgnd outb outa h bridge level shift & pre driver logic 2
3/4 rev. a ? bd6886gul electrical characteristics (unless other wise specified, ta=25c, vcc=3.0v, vm=5.0v) parameter symbol limit unit conditions min. typ. max. overall circuit current during standby operation iccst - 0 10 a ps=l circuit current 1 icc - 0.9 1.4 ma ps=h with no signal circuit current 2 im - 0.4 0.65 ma ps=h, and vlim=5v with no signal control input high-level input voltage vinh 2.0 - - v ina, inb, sel, ps low-level input voltage vinl - - 0.7 v ina, inb, sel, ps high-level input current iinh 15 30 60 a ina, inb, sel, ps; vin=3v low-level input current iinl -1 0 - a ina, inb, sel, ps; vin=0v pull-down resistor rin 50 100 200 k ? ina, inb, sel, ps input for constant-voltage setting input current ivlim -1.5 -0.5 - a vlim=0v uvlo uvlo voltage vuvlo 1.6 - 2.4 v constant-voltage drive block (ch1) output on-resistance ron - 0.8 1.2 ? io= ? 150ma on high and low sides in total output high-level voltage voh 1.9 ? vlim 2.0 ? vlim 2.1 ? vlim v vlim=1v with 10 ? load turn-on time ton - 1.5 5.0 s io= ? 150ma with 10 ? load 4 turn-off time toff - 0.1 2.0 s io= ? 150ma with 10 ? load 4 rise time tr - 2.0 8.0 s io= ? 150ma with 10 ? load 4 fall time tf - 0.05 1.0 s io= ? 150ma with 10 ? load 4 4 design target value (no total shipment inspection is made.) ? i/o truth table bd6886gul i/o truth table input mode input output ps sel ina inb outxa outxb en/in h l l x z z h l h l h h l h in/in h h h z z h l h l l h l h l l l l - l x x x z z l: low, h: high, x: don?t care, z: high impedance the outputs are provided with feed back resistor . this is so that gnd voltage will be output, when the output is ?z?.
4/4 rev. a ? operation notes (1) absolute maximum ratings use of the ic in excess of absolute maximum ratings su ch as the applied voltage or operating temperature range (topr) may result in ic damage. assumptions should not be made regarding the state of the ic (short mode or open mode) when such damage is suffered. the implementation of a physical safety measure such as a fuse should be considered when use of the ic in a spec ial mode where the absolute maximum ratings may be exceeded is anticipated. (2) power supply lines regenerated current may flow as a result of the motor's back electromotive force. insert capacitors between the power supply and ground pins to serve as a route for regenerated current. determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. if the connecte d power supply does not have sufficient current absorption capacity, regenerative current will cause the vo ltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. it is recommended to implement a physical safety measure such as the inse rtion of a voltage clamp diode between the power supply and gnd pins. (3) ground potential ensure a minimum gnd pin potential in all operating conditions. (4) setting of heat use a thermal design that allows for a sufficient margin in light of the power dissipat ion (pd) in actual operating conditions. (5) actions in strong magnetic field use caution when using the ic in t he presence of a strong m agnetic field as doing so may cause the ic to malfunction. (6) aso when using the ic, set the output transistor for the motor so that it does not exceed absolute maximum ratings or aso. (7) thermal shutdown circuit this ic incorporates a tsd (thermal shutdown) circuit (t sd circuit). if the temperatur e of the chip reaches the following temperature, the motor coil output will be open ed. the thermal shutdown circuit (tsd circuit) is designed only to shut the ic off to prevent runaway ther mal operation. it is not designed to protect the ic or guarantee its operation. do not continue to use the ic after operating this circuit or use the ic in an environment where the operation of this circuit is assumed. tsd on temperature [c] (typ.) hysteresis temperature [c] (typ.) 175 25 (8) ground wiring pattern when using both small signal and large current gnd patte rns, it is recommended to isolate the two ground patterns, placing a single ground point at the application' s reference point so that the pattern wiring resistance and voltage variations caused by large currents do not c ause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either.
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